Nanostructures were formed on diced specimens of single crystal 4H-SiC silicon carbide using
electron beam lithography. A scanning electron microscope was retrofitted with
a commercially available electron beam lithography package and an electrostatic
beam blanker to permit nanoscale lithography to be performed. A process was
first developed and optimized on silicon substrates to expose,
poly-methyl-methacrylate (PMMA) resist with an electron beam to make nanoscale
nickel masks for reactive ion etching. The masks consist of an array of nickel
dots that range in size from 20 to 100 nm in diameter. Several nanoscale
structures were then fabricated in silicon carbide using
electron beam lithography. The structures produced are characterized by field
emission scanning electron microscopy.
Source:IEEE
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